Burr removal from high-aspect-ratio micro-pillars using ultrasonic-assisted abrasive micro-deburring

Abstract The demand for high-aspect-ratio microstructures is ever increasing in the fields of microelectromechanical systems, biomedicine, aerospace, telecommunication, and heat transfer. Mechanical micromachining processes have a distinct advantage over lithography-based machining complex three-dimensional on variety materials with high accuracy surface finish. But tool-based operations face inherent issues form excessive burr formation, which needs to be addressed by post-machining removal operations. In this study, an ultrasonic-assisted abrasive micro-deburring process employing probe sonotrode particles has been investigated deburring micro-pillars machined aluminium 6061 copper. Deburring micromilled pillars aspect ratio 5:1 achieved while maintaining pillar integrity. mechanism observed mainly impact minor role played liquid cavitation. Burr reduction as 88.75% Al 90.1% copper short processing time 10 s. This significantly faster than other ultrasonic cavitation-based described literature (deburring ranging from 60 min few hours). With proper control parameters like stand-off distance power, integrity micro-pillars. Pure water cavitation also studied comparison, resulted 51.5% 53.1% copper, respectively. Upon selection parameters, can viable alternative existing methods terms minimal structure damage.